US 12,456,670 B2
Electronic device
Chia-Lin Yang, Miao-Li County (TW); Sheng-Nan Chen, Miao-Li County (TW); Kuang-Ming Fan, Miao-Li County (TW); Kuan-Feng Lee, Miao-Li County (TW); Jui-Jen Yueh, Miao-Li County (TW); and Chin-Ming Huang, Miao-Li County (TW)
Assigned to InnoLux Corporation, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Sep. 29, 2022, as Appl. No. 17/955,557.
Claims priority of application No. 202210806204.9 (CN), filed on Jul. 8, 2022.
Prior Publication US 2024/0014116 A1, Jan. 11, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/3677 (2013.01); H01L 23/49816 (2013.01); H01L 23/5386 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/0903 (2013.01); H01L 2924/30101 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an electronic unit, comprising:
a chip;
an insulating layer disposed on the chip, wherein the insulating layer comprises a first opening, a surface and a side surface connecting the surface; and
a first conductor layer disposed in the first opening;
a circuit layer disposed corresponding to the electronic unit, wherein the circuit layer comprises a second opening and a second conductor layer disposed in the second opening;
a bonding pad being in contact with the second conductor layer, wherein the bonding pad is electrically connected to the electronic unit; and
an encapsulation layer surrounding the electronic unit, wherein a third conductor layer of the circuit layer overlaps the insulating layer and the encapsulation layer,
wherein the first conductor layer has a first height, the second conductor layer has a second height, and a ratio of the first height to the second height is greater than or equal to 0.1 and less than or equal to 0.9,
wherein the third conductor layer is in contact with at least a portion of the surface and at least a portion of the side surface of the insulating layer, and the third conductor layer is in contact with a surface of the encapsulation layer.