US 12,456,669 B2
Semiconductor device
Yuto Tanaka, Kanagawa (JP); Shuichi Oka, Kanagawa (JP); Shun Mitarai, Kanagawa (JP); Kiwamu Adachi, Kanagawa (JP); Takahiro Igarashi, Kanagawa (JP); Hiizu Ohtorii, Kanagawa (JP); Naoki Kakoiyama, Kanagawa (JP); Kousuke Seki, Kanagawa (JP); and Hiroyuki Shigeta, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/906,847
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Mar. 23, 2021, PCT No. PCT/JP2021/012062
§ 371(c)(1), (2) Date Sep. 20, 2022,
PCT Pub. No. WO2021/200406, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-065086 (JP), filed on Mar. 31, 2020.
Prior Publication US 2023/0125605 A1, Apr. 27, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01Q 1/38 (2006.01); H10F 39/00 (2025.01)
CPC H01L 23/49827 (2013.01) [H01L 21/486 (2013.01); H01L 23/544 (2013.01); H01L 23/562 (2013.01); H01Q 1/38 (2013.01); H10F 39/804 (2025.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01)] 44 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a glass substrate that includes:
a first surface,
a second surface opposite to the first surface, and
a first side surface between the first surface and the second surface;
a plurality of wirings that includes:
a first wiring on the first surface, and
a second wiring on the second surface;
a first insulating film that covers the first surface;
a second insulating film that covers the second surface;
a third insulating film that covers the first side surface, wherein the third insulating film is continuous with at least one of the first insulating film or the second insulating film;
a first through hole that penetrates through the glass substrate between the first surface and the second surface;
a first metal film that covers an inner wall of the first through hole; and
a fourth insulating film inside the first metal film in the first through hole.