US 12,456,668 B2
Package structure, antenna module and probe card
Chieh-Wei Feng, Taoyuan (TW); Tai-Jui Wang, Kaohsiung (TW); Jui-Wen Yang, New Taipei (TW); and Tzu-Yang Ting, Taipei (TW)
Assigned to Industrial Technology Research Institute, Hsinchu (TW)
Filed by Industrial Technology Research Institute, Hsinchu (TW)
Filed on Mar. 30, 2022, as Appl. No. 17/707,964.
Claims priority of provisional application 63/238,779, filed on Aug. 31, 2021.
Claims priority of application No. 111106297 (TW), filed on Feb. 22, 2022.
Prior Publication US 2023/0071946 A1, Mar. 9, 2023
Int. Cl. H01L 23/498 (2006.01); G01R 1/073 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/49822 (2013.01) [G01R 1/07342 (2013.01); H01L 23/66 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a connection member comprising a conductive connector and an insulation layer surrounding the conductive connector; and
a first redistribution structure disposed on the connection member and comprising:
a first dielectric layer disposed on the connection member;
first wiring pattern disposed in the first dielectric layer;
a first device disposed above the first dielectric layer and electrically connected to the conductive connector; and
dummy patterns, wherein the dummy patterns are disposed in the first dielectric layer and electrically isolated from the conductive connector.