US 12,456,659 B2
Printed micro and nanostructured arrays for thermal management of electronic devices
Anthony Childress, Boston, MA (US); and Ahmed Busnaina, Needham, MA (US)
Assigned to Northeastern University, Boston, MA (US)
Filed by Northeastern University, Boston, MA (US)
Filed on May 31, 2022, as Appl. No. 17/828,551.
Claims priority of provisional application 63/194,313, filed on May 28, 2021.
Prior Publication US 2022/0384302 A1, Dec. 1, 2022
Int. Cl. H01L 23/367 (2006.01); B82Y 30/00 (2011.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4882 (2013.01); H01L 23/3677 (2013.01); H01L 23/3737 (2013.01); B82Y 30/00 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A thermal management system for a chip-based electronic device, the system comprising:
a first microscale or nanoscale thermal emitter in thermal contact with a heat-producing electronic component, the first emitter configured to absorb thermal energy from the component and emit near infrared (NIR) radiation away from the component, wherein the first emitter is configured as a grid structure; and
a second microscale or nanoscale thermal emitter in thermal contact with an outer surface of an outer package of the electronic device, the second emitter configured to absorb thermal energy from the outer package and emit NIR radiation away from the outer package, wherein the thermal energy absorbed from the outer package comprises thermal energy radiated away from said component by the first emitter, wherein the second emitter is configured as a grid structure.