US 12,456,658 B2
Knockdown heat sink structure
Yuan-Yi Lin, New Taipei (TW); and Fu-Kuei Chang, New Taipei (TW)
Assigned to ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed by ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed on May 11, 2023, as Appl. No. 18/196,413.
Claims priority of application No. 111143220 (TW), filed on Nov. 11, 2022.
Prior Publication US 2024/0162108 A1, May 16, 2024
Int. Cl. H01L 23/367 (2006.01)
CPC H01L 23/3672 (2013.01) 4 Claims
OG exemplary drawing
 
1. A knockdown heat sink structure comprising
a carrier plate having at least one high-temperature section in contact with at least one heat source, a section of the carrier plate, which is not in contact the heat source or distal from the heat source being defined as a non-high-temperature section,
a first radiating fin assembly with a height disposed directly on the non-high-temperature section,
a second radiating fin assembly higher than the height of the first radiating fin assembly disposed directly on the high-temperature section, the second radiating fin assembly including multiple second radiating fins, each second radiating fin having a first part, the first part having a bottom end and a top end, the bottom end connected directly with or integrally formed on the high-temperature section of the carrier plate, the top end of the first part of the second radiating fin assembly being higher than the height of the first radiating fin assembly, a second part outward spreading and extending from the top end of the first part, the second part covering the first radiating fin assembly without contacting the same, whereby a spacing flow way is defined between the first radiating fin assembly and the second part of the second radiating fin assembly, a top end of the second part of the second radiating fin being higher than the height of the first radiating fin assembly, whereby the space above the high-temperature section of the carrier plate provides larger heat dissipation area for the high-temperature section.