US 12,456,657 B2
Heat dissipating element
Michel Devers, Lumbin (FR)
Assigned to STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed by STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed on Sep. 15, 2022, as Appl. No. 17/945,638.
Claims priority of application No. 2110078 (FR), filed on Sep. 24, 2021.
Prior Publication US 2023/0100750 A1, Mar. 30, 2023
Int. Cl. H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/367 (2013.01) [H01L 23/3121 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an electronic die within a package; and
a heat diffusion element made of a thermally-conductive material;
wherein said heat diffusion element comprises:
a main portion resting on at least a portion of an upper surface of the electronic die;
at least one secondary portion flush with an upper surface of the package; and
at least one intermediate portion coupling the main portion to the at least one secondary portion;
wherein each secondary portion is formed of a first portion having the shape of a rectangle and a second portion having the shape of a trapezoid, one side of the rectangle and a long base of the trapezoid being contiguous.