US 12,456,653 B2
Packaging substrate and semiconductor device comprising the same
Youngho Rho, Suwon-si (KR); and Jincheol Kim, Suwon-si (KR)
Assigned to Absolics Inc., Covington, GA (US)
Appl. No. 18/010,809
Filed by Absolics Inc., Covington, GA (US)
PCT Filed Apr. 28, 2022, PCT No. PCT/US2022/026847
§ 371(c)(1), (2) Date Dec. 16, 2022,
PCT Pub. No. WO2022/232467, PCT Pub. Date Nov. 3, 2022.
Claims priority of application No. 10-2021-0056448 (KR), filed on Apr. 30, 2021.
Prior Publication US 2023/0307304 A1, Sep. 28, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 23/13 (2013.01) [H01L 23/15 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/105 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/17181 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A packaging substrate comprising:
a glass substrate comprising a first surface and a second surface which is the opposite surface of the first surface;
a cavity unit having a space formed inside the glass substrate;
a cavity frame dividing the space into plural districts; and
a cavity element comprised in at least some of the cavity unit,
wherein the cavity frame comprises a frame through hole penetrating in a direction from the one surface to the other surface,
wherein the frame through hole has a diameter of 30 μm to 500 μm, and
the cavity frame has a width of 1.5 times or more and 5 times or less compared to the diameter of the frame through hole.