US 12,456,643 B2
Substrate treating apparatus and substrate treating method
Youngjun Son, Cheonan-si (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Apr. 6, 2023, as Appl. No. 18/296,586.
Claims priority of application No. 10-2022-0091154 (KR), filed on Jul. 22, 2022.
Prior Publication US 2024/0030057 A1, Jan. 25, 2024
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68742 (2013.01) [H01L 21/67103 (2013.01); H01L 21/67288 (2013.01); H01L 21/6875 (2013.01); H01L 21/68757 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a support plate having a first decompression hole and a second decompression hole in a first surface facing a substrate and including a first decompression flow path connected to the first decompression hole and a second decompression flow path connected to the second decompression hole;
a plurality of movable pins protruding from the first surface of the support plate and configured to contact a conductive line according to movement in a first direction; and
a controller configured to adjust an order of decompressing the first decompression flow path and the second decompression flow path,
wherein the controller is further configured to determine the order of decompressing the first decompression flow path and the second decompression flow path according to a distance between the first decompression hole and a first contact pin which is selected from the plurality of movable pins and comes into contact with the conductive line first and a distance between the second decompression hole and the first contact pin.