US 12,456,642 B2
Module
Tadashi Nomura, Nagaokakyo (JP); and Tetsuo Sato, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Jul. 29, 2022, as Appl. No. 17/816,014.
Application 17/816,014 is a continuation of application No. PCT/JP2021/001984, filed on Jan. 21, 2021.
Claims priority of application No. 2020-016296 (JP), filed on Feb. 3, 2020.
Prior Publication US 2022/0367233 A1, Nov. 17, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2023.01)
CPC H01L 21/6836 (2013.01) [H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/165 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68386 (2013.01); H01L 2223/6677 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first surface and a second surface opposed to each other;
a component mounted on the first surface;
a sealing resin covering the first surface and the component;
a shield film provided to cover an upper surface and a side surface of the sealing resin and a side surface of the substrate; and
a resist film provided to cover the second surface, wherein
the resist film has a plurality of regularly arranged protrusions.