US 12,456,640 B2
Electrostatic chuck
Wataru Fujita, Higashiomi (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 18/274,834
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Jan. 25, 2022, PCT No. PCT/JP2022/002708
§ 371(c)(1), (2) Date Jul. 28, 2023,
PCT Pub. No. WO2022/163656, PCT Pub. Date Aug. 4, 2022.
Claims priority of application No. 2021-012365 (JP), filed on Jan. 28, 2021.
Prior Publication US 2024/0105489 A1, Mar. 28, 2024
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 3 Claims
OG exemplary drawing
 
1. An electrostatic chuck comprising:
a plate-shaped body comprising an adsorption surface for mounting a workpiece;
a base; and
an electrode film located between the plate-shaped body and the base, wherein
the plate-shaped body and the base are made of sapphire, the plate-shaped body and the base face each other, a c-axis of the sapphire forming the plate-shaped body and a c-axis of the sapphire forming the base being not parallel to each other, and
an angle between the adsorption surface and a c-plane of the sapphire is 45° or more.