US 12,456,633 B2
Wafer cleaning equipment
Yunseok Choi, Suwon-si (KR); Eunseok Lee, Suwon-si (KR); Seungri Ju, Suwon-si (KR); Yungjun Kim, Gyeonggi-do (KR); Jaehyun Sung, Suwon-si (KR); and Yongkyu Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 5, 2023, as Appl. No. 18/296,336.
Claims priority of application No. 10-2022-0079998 (KR), filed on Jun. 29, 2022.
Prior Publication US 2024/0006195 A1, Jan. 4, 2024
Int. Cl. H01L 21/67 (2006.01); B08B 3/02 (2006.01); B08B 3/12 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67051 (2013.01) [B08B 3/02 (2013.01); B08B 3/12 (2013.01); H01L 21/02057 (2013.01); H01L 21/67057 (2013.01); H01L 21/68728 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wafer cleaning equipment, comprising:
a vessel that includes a first inner wall, a second inner wall that faces the first inner wall, and a bottom connected to the first and second inner walls;
a plurality of first nozzles disposed on the first inner wall;
a plurality of second nozzles disposed on the second inner wall;
a support structure disposed between the plurality of first nozzles and the plurality of second nozzles, wherein the support structure is configured to support a wafer; and
a megasonic cleaner disposed between the bottom of the vessel and the wafer supported by the support structure,
wherein the megasonic cleaner includes a rack and at least one vibrator disposed under the rack and configured to transmit energy to a cleaning solution accommodated in the rack as waves.