US 12,456,629 B2
Method of producing substrates for semiconductor device packages comprising anchoring encapsulation to die pad
Mauro Mazzola, Calvenzano (IT); and Roberto Tiziani, Nerviano (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Jul. 26, 2022, as Appl. No. 17/873,967.
Claims priority of application No. 102021000020555 (IT), filed on Jul. 30, 2021.
Prior Publication US 2023/0031356 A1, Feb. 2, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01)
CPC H01L 21/4842 (2013.01) [H01L 21/4828 (2013.01); H01L 23/49503 (2013.01); H01L 23/49558 (2013.01); H01L 23/49586 (2013.01); H01L 24/48 (2013.01); H01L 2224/48245 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a sculptured electrically conductive laminar structure having spaces therein, wherein the sculptured electrically conductive laminar structure has a first thickness and includes at least one die pad having a first die pad surface configured to mount a semiconductor chip mounted and a second die pad surface opposite the first die pad surface, wherein the at least one die pad has a second thickness between the first die pad surface and the second die pad surface, the second thickness being less than the first thickness;
providing said sculptured electrically conductive laminar structure with at least one pillar formation protruding from the second die pad surface, wherein each pillar formation has a height equal to a difference between said first thickness and said second thickness;
clamping the sculptured electrically conductive laminar structure between a first planar clamping surface and a second planar clamping surface of a pre-mold tool with the first planar clamping surface of the pre-mold tool abutting against the first die pad surface and the second planar clamping surface of the pre-mold tool abutting against a distal end portion of each pillar formation, wherein a distance between the first planar clamping surface and the second planar clamping surface is substantially equal to said first thickness;
molding insulating pre-mold material to penetrate into said spaces of the sculptured electrically conductive laminar structure clamped between the first and second planar clamping surfaces of the pre-mold tool and provide a laminar pre-molded substrate having said first thickness and including said first die pad surface and distal end portion of each pillar formation left exposed by the pre-mold material; and
then removing said at least one pillar formation protruding from the second die pad surface.