US 12,456,613 B2
Plasma processing system, plasma processing apparatus, and method for replacing edge ring
Kazuki Moyama, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jun. 21, 2021, as Appl. No. 17/352,383.
Claims priority of application No. 2020-106756 (JP), filed on Jun. 22, 2020.
Prior Publication US 2021/0398783 A1, Dec. 23, 2021
Int. Cl. H01J 37/32 (2006.01); H01L 21/687 (2006.01)
CPC H01J 37/32807 (2013.01) [H01J 37/32642 (2013.01); H01J 37/32724 (2013.01); H01L 21/68735 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A plasma processing system comprising:
a plasma processing apparatus configured to perform plasma processing on a substrate; and
a pressure-reducible transfer apparatus connected to the plasma processing apparatus,
wherein the plasma processing apparatus includes:
a pressure-reducible processing chamber;
an electrostatic chuck disposed in the processing chamber, the electrostatic chuck having a support surface having thereon an edge ring assembly that includes a heat transfer sheet that is attached to an edge ring, and the edge ring surrounding the substrate supported by the support surface, wherein a surface of the heat transfer sheet opposite to a surface in contact with the edge ring includes a silicone resin or fluororesin coating to improve peelability;
an electrode is arranged in the electrostatic chuck, which is below the support surface on which the edge ring assembly is placed, to electrostatically attract and hold the edge ring, wherein the support surface on which the edge ring assembly is placed is formed without having a heat transfer gas supply hole; and
a delivery structure to vertically move the edge ring assembly to transfer the edge ring assembly between the plasma processing apparatus and the pressure-reducible transfer apparatus,
wherein the pressure-reducible transfer apparatus includes:
a pressure-reducible transfer chamber connected to the processing chamber; and
a transferer to transfer the edge ring assembly between the processing chamber and the pressure-reducible transfer chamber,
wherein, without exposing the processing chamber to the atmosphere,
the transferer supports the heat transfer sheet of the edge ring assembly and moves the edge ring assembly to a position above the support surface,
the delivery structure receives the edge ring assembly from the transferer and supports the heat transfer sheet of the edge ring assembly, and
the support surface receives the edge ring assembly from the delivery structure such that the edge ring is placed on the support surface via the heat transfer sheet.