| CPC H01J 37/32651 (2013.01) [H01J 37/32642 (2013.01); H01J 2237/3343 (2013.01)] | 20 Claims |
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1. A substrate processing apparatus comprising:
a chamber comprising a support, the support configured to mount a substrate thereon;
at least one channel disposed in the chamber and into which an electrically conductive fluid or an electrically non-conductive fluid is configured to be injected; and
a control unit comprising:
a first pump and a second pump configured to respectively supply the electrically conductive fluid and the electrically non-conductive fluid to the at least one channel; and
a first valve configured to receive the electrically conductive fluid and the electrically non-conductive fluid from the first pump and the second pump, respectively, and control proportions of each of the electrically conductive fluid and the electrically non-conductive fluid at which the electrically conductive fluid and the electrically non-conductive fluid are injected into the at least one channel,
wherein the control unit is configured to alternately supply the electrically conductive fluid and the electrically non-conductive fluid to the at least one channel such that the electrically non-conductive fluid is provided between portions of the electrically conductive fluid within the at least one channel, and
the electrically conductive fluid is a liquid metal, and the electrically non-conductive fluid comprises at least one from among deionized water (DIW), air, and oil.
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