US 12,456,609 B2
Plasma processing apparatus
Taro Ikeda, Nirasaki (JP); Satoru Kawakami, Nirasaki (JP); and Kenta Kato, Nirasaki (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jul. 25, 2022, as Appl. No. 17/872,560.
Claims priority of application No. 2021-126055 (JP), filed on Jul. 30, 2021.
Prior Publication US 2023/0031447 A1, Feb. 2, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/3244 (2013.01) [H01J 37/32238 (2013.01); H01J 37/32247 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A plasma processing apparatus comprising:
a processing container including a substrate support provided therein;
a shower head configured to supply active species of a first gas into the processing container;
a first dissociation space configured such that the active species of the first gas is plasmarized;
a second dissociation space provided in the processing container separately from the first dissociation space, and configured such that the active species of the first gas plasmarized in the first dissociation space is supplied to the shower head to be additionally plasmarized; and
a resonator configured to supply electromagnetic waves in a VHF band or higher to the first dissociation space,
wherein the resonator includes:
a cylindrical body that constitutes a housing of the resonator;
a gas pipe which passes through an interior of the cylindrical body, is provided along a central axis direction of the cylindrical body, includes a plurality of gas holes formed in an end portion of the gas pipe, and is configured to supply the first gas into the first dissociation space through the plurality of gas holes; and
a dielectric window including a central portion through which the end portion of the gas pipe passes, and configured to seal a space between the gas pipe and the cylindrical body and cause the electromagnetic waves to transmit through the first dissociation space.