US 12,456,606 B2
Support unit and apparatus for treating substrate
Hyoungkyu Son, Seoul (KR); Jong-Hwan An, Gyeonggi-do (KR); Jae Hyun Cho, Gyeonggi-do (KR); Min Keun Bae, Chungcheongnam-do (KR); Ogsen Galstyan, Chungcheongnam-do (KR); Dong Suk Kim, Gyeonggi-do (KR); Hyeon Gyu Kim, Chungcheongnam-do (KR); Won Seok Lee, Seoul (KR); and Sung Je Kim, Gyeonggi-dO (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Dec. 8, 2021, as Appl. No. 17/545,130.
Claims priority of application No. 10-2020-0178366 (KR), filed on Dec. 18, 2020.
Prior Publication US 2022/0199368 A1, Jun. 23, 2022
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32211 (2013.01) [H01J 37/32532 (2013.01); H01J 37/32715 (2013.01); H01J 37/32633 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A support unit included in an apparatus for treating a substrate using plasma and configured to support the substrate, the support unit comprising:
a power supply rod connected to a high-frequency power supply;
an electrode plate configured to receive power from the power supply rod;
a ground ring provided to surround the electrode plate when viewed from the top and including a ground ring to be grounded;
an insulating member disposed between the ground ring and the electrode plate when viewed from the top;
an elevating member configured to move the ground ring in a vertical direction, wherein the elevating member comprises a first rotation shaft configured to transmit rotational motion to a second rotation shaft, and wherein the first rotation shaft is perpendicular to the second rotation shaft; and
a ground plate, wherein the ground plate is grounded and is configured to support at least a portion of the insulating member.