US 12,456,585 B2
Multilayer ceramic capacitor
Suguru Nakano, Nagaokakyo (JP); Satoshi Muramatsu, Nagaokakyo (JP); Risa Hojo, Nagaokakyo (JP); and Yoshiyuki Nomura, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jun. 22, 2023, as Appl. No. 18/212,809.
Application 18/212,809 is a continuation of application No. 17/119,263, filed on Dec. 11, 2020, granted, now 11,728,096.
Claims priority of application No. 2019-224655 (JP), filed on Dec. 12, 2019.
Prior Publication US 2023/0352242 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A multilayer ceramic capacitor comprising:
a laminate including a plurality of dielectric layers and a plurality of internal electrode layers laminated together; and
external electrodes on surfaces of the laminate and electrically connected to the plurality of internal electrode layers; wherein
the laminate includes a first main surface and a second main surface that oppose each other in a lamination direction, a first side surface and a second side surface that oppose each other in a length direction perpendicular or substantially perpendicular to the lamination direction, and a third side surface and a fourth side surface that oppose each other in a width direction perpendicular or substantially perpendicular to the lamination direction and the length direction;
a distance in the length direction between the first side surface and the second side surface of the laminate is equal or substantially equal to a distance in the width direction between the third side surface and the fourth side surface of the laminate;
a dimension T in the lamination direction of the multilayer ceramic capacitor is about 50 μm or greater and about 200 μm or smaller;
the first main surface of the laminate is a mounting surface and the second main surface of the laminate is a counter surface;
the external electrodes include a first external electrode on the first side surface of the laminate, a second external electrode on the second side surface of the laminate, and a third external electrode on the second side surface of the laminate;
the first external electrode wraps around from the first side surface to the first main surface, the second main surface, and the third side surface;
when viewed from the width direction, the first external electrode has a U-shape or substantially a U-shape on the third side surface;
the second external electrode wraps around from the second side surface to the first main surface, the second main surface, and the third side surface;
when viewed from the width direction, the second external electrode has a U-shape or substantially a U-shape on the third side surface;
a length ratio EB1/EA1 of the first external electrode wrapping around to the main surfaces is more than 0 and about 0.5 or less, where EA1 represents a distance from an end of the first external electrode wrapping around to the first main surface of the laminate to the first side surface of the laminate, and EB1 represents a distance from an end of the first external electrode wrapping around to the second main surface of the laminate to the first side surface of the laminate;
a length ratio EB2/EA2 of the second external electrode wrapping around to the main surfaces is more than 0 and about 0.5 or less, where EA2 represents a distance from an end of the second external electrode wrapping around to the first main surface of the laminate to the second side surface of the laminate, and EB2 represents a distance from an end of the second external electrode wrapping around to the second main surface of the laminate to the second side surface of the laminate;
the first external electrode includes a base electrode layer on the first main surface and the second main surface of the laminate, and a plating layer;
the plating layer includes a Cu plating layer, a Ni plating layer, and a Sn plating layer;
an average thickness of the Cu plating layer is about 5 μm or greater and about 8 μm or smaller;
an average thickness of the Ni plating layer is about 2 μm or greater and about 4 μm or smaller;
when viewed from the lamination direction, the first external electrode has a square or substantially square shape;
the third external electrode wraps around from the second side surface to the first main surface, the second main surface, and the fourth side surface; and
when viewed from the width direction, the third external electrode has a U-shape or substantially a U-shape on the fourth side surface.