US 12,456,583 B2
Ceramic electronic component and method of manufacturing the same
In Ho Jeon, Suwon-si (KR); Seok Hyun Yoon, Suwon-si (KR); Jin Woo Kim, Suwon-si (KR); Byung Kil Yun, Suwon-si (KR); Bon Hyeong Koo, Suwon-si (KR); Min Jung Jang, Suwon-si (KR); and Mi Yang Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 6, 2023, as Appl. No. 18/242,833.
Claims priority of application No. 10-2022-0187735 (KR), filed on Dec. 28, 2022.
Prior Publication US 2024/0153705 A1, May 9, 2024
Int. Cl. H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/0085 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A ceramic electronic component, comprising:
a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer; and
an external electrode disposed on the body,
wherein the dielectric layer includes a first region extending from an interfacial surface between the dielectric layer and the internal electrode to a thickness of 50 nm in the dielectric layer and a second region excluding the first region, and
wherein, the first region includes In and Sn, and in the first region, an average content of In based on overall elements excluding oxygen is 0.5 at % or more and 2.0 at % or less, and an average content of Sn based on the overall elements excluding oxygen is 0.5 at % or more and 1.75 at % or less.