US 12,456,579 B2
Multilayer electronic component
Jung Won Park, Suwon-si (KR); Hyung Jong Choi, Suwon-si (KR); So Jung An, Suwon-si (KR); Yoo Jeong Lee, Suwon-si (KR); Kwang Yeun Won, Suwon-si (KR); Woo Kyung Sung, Suwon-si (KR); Byung Jun Jeon, Suwon-si (KR); and Chul Seung Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 20, 2023, as Appl. No. 18/382,204.
Claims priority of application No. 10-2022-0176785 (KR), filed on Dec. 16, 2022.
Prior Publication US 2024/0203646 A1, Jun. 20, 2024
Int. Cl. H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/008 (2013.01) [H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body,
wherein the external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.