US 12,456,574 B2
Coil device
Kenji Nishimura, Tokyo (JP); and Susumu Tokura, Tokyo (JP)
Assigned to IHI CORPORATION, Tokyo (JP)
Appl. No. 18/282,065
Filed by IHI Corporation, Tokyo (JP)
PCT Filed Feb. 1, 2022, PCT No. PCT/JP2022/003832
§ 371(c)(1), (2) Date Sep. 14, 2023,
PCT Pub. No. WO2022/219882, PCT Pub. Date Oct. 20, 2022.
Claims priority of application No. 2021-067586 (JP), filed on Apr. 13, 2021.
Prior Publication US 2024/0153698 A1, May 9, 2024
Int. Cl. H01F 38/14 (2006.01); B60L 53/12 (2019.01); B60L 53/30 (2019.01); H01F 27/02 (2006.01)
CPC H01F 38/14 (2013.01) [B60L 53/12 (2019.02); B60L 53/30 (2019.02); H01F 27/02 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A coil device comprising:
a main unit including a coil that wirelessly transmits or receives electric power, a main housing that accommodates the coil and is fixed to an installation target, and a first magnetic member forming a first magnetic path portion related to the coil; and
a sub-unit in which an electrical function unit that provides the main unit with an electrical function performed by at least one of an electric component, a sub-housing that is detachably attached to the main housing and accommodates the control substrate, and a second magnetic member forming a second magnetic path portion magnetically connected to the first magnetic path portion,
wherein the main unit includes an accommodation portion that detachably accommodates the sub-unit,
wherein the main housing includes a main base fixed to the installation target and a main cover forming a region for accommodating the coil together with the main base,
wherein the sub-housing includes a sub-base configured to be attached to the main housing and a sub-cover forming a region for accommodating the control substrate together with the sub-base,
wherein the first magnetic member is disposed between the main base and the coil and forms the first magnetic path portion between the main base and the coil, and
wherein the second magnetic member is disposed between the control substrate and the sub-cover and forms the second magnetic path portion between the control substrate and the sub-cover.