| CPC H01F 27/292 (2013.01) [H01F 17/0013 (2013.01); H01F 27/327 (2013.01); H01F 41/041 (2013.01); H01F 2017/0066 (2013.01)] | 19 Claims |
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1. An inductor component comprising:
a body which has a principal surface;
inductor wiring which extends parallel to the principal surface inside the body, the inductor wiring having a wiring body which extends in a linear shape in a single layer, a first pad which is provided in the single layer on a first end portion of the wiring body, and a second pad which is provided in the single layer on a second end portion of the wiring body;
a first vertical wiring which is connected to the first pad and extends in a thickness direction orthogonal to the principal surface and is exposed without being obstructed by the principal surface;
a second vertical wiring which is connected to the second pad and extends in the thickness direction orthogonal to the principal surface and is exposed without being obstructed by the principal surface; and
an outer terminal which is arranged on the first vertical wiring exposed without being obstructed by the principal surface and at least part of which protrudes from the principal surface, the at least part including a distal end that protrudes and that is a solder portion which is made of an alloy of tin lower in melting point than the inductor wiring and the first vertical wiring,
wherein, when viewed in the thickness direction, the outer terminal is larger than the vertical wiring in a longitudinal direction but smaller than the vertical wiring in a transverse direction orthogonal to the longitudinal direction,
the solder portion covers a range from above the first vertical wiring to above the body and has a plurality of voids inside, and
a density of voids which are contained in a portion of the solder portion above the first vertical wiring is smaller than a density of voids of the solder portion which are contained in a portion above the body.
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