US 12,456,562 B2
Ceramic RF feedthrough component
John P. Bellora, San Diego, CA (US)
Assigned to Integrated Microwave Corporation, San Diego, CA (US)
Filed by Integrated Microwave Corporation, San Diego, CA (US)
Filed on Jan. 31, 2024, as Appl. No. 18/428,203.
Prior Publication US 2025/0246342 A1, Jul. 31, 2025
Int. Cl. H01B 11/00 (2006.01); H05K 9/00 (2006.01)
CPC H01B 11/00 (2013.01) [H05K 9/0015 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A radio frequency (RF) feedthrough component comprising:
a ceramic body having an outer peripheral surface and an aperture with an inner peripheral surface;
a non-ferrous conductor adhered to the outer peripheral surface of the ceramic body and to the inner peripheral surface of the aperture;
a non-ferrous conductive lead disposed through the aperture, a portion of the non-ferrous conductive lead disposed in the aperture of the ceramic body and another portion of the non-ferrous conductive lead protruding from at least one side of the ceramic body;
a non-ferrous hermetic seal between the portion of the non-ferrous conductive lead disposed in the aperture and the non-ferrous conductor adhered to the surface of the aperture;
wherein a characteristic impedance of the feedthrough is greater than 20 ohms.