US 12,455,691 B2
Memory device controlled low temperature thermal throttling
Marco Redaelli, Munich (DE)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 16, 2023, as Appl. No. 18/511,304.
Claims priority of provisional application 63/385,437, filed on Nov. 30, 2022.
Prior Publication US 2024/0176506 A1, May 30, 2024
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0619 (2013.01) [G06F 3/0634 (2013.01); G06F 3/0659 (2013.01); G06F 3/0673 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
one or more components configured to:
receive, from a host device, low temperature thermal throttling information that enables a thermal throttling operation by the memory device,
wherein the low temperature thermal throttling information includes an indication of a temperature threshold;
initiate the thermal throttling operation based on the low temperature thermal throttling information,
wherein the one or more components, to initiate the thermal throttling operation, are configured to move dummy data from a controller associated with the memory device to a particular location of the memory device associated with the thermal throttling operation;
stop the thermal throttling operation to perform a write operation associated with a write command or a read operation associated with a read command; and
complete the thermal throttling operation based on a temperature of the memory device satisfying the temperature threshold.