US 12,455,630 B2
See-through computer display systems
Ralph F. Osterhout, San Francisco, CA (US); Robert Michael Lohse, Palo Alto, CA (US); Nima Shams, San Jose, CA (US); John D. Haddick, Mill Valley, CA (US); and John N. Border, Eaton, NH (US)
Assigned to Mentor Acquisition One, LLC, Plantation, FL (US)
Filed by Mentor Acquisition One, LLC, Plantation, FL (US)
Filed on Oct. 30, 2024, as Appl. No. 18/932,461.
Application 18/932,461 is a continuation of application No. 18/366,629, filed on Aug. 7, 2023, granted, now 12,164,693.
Application 18/366,629 is a continuation of application No. 17/576,849, filed on Jan. 14, 2022, granted, now 11,809,628, issued on Nov. 7, 2023.
Application 17/576,849 is a continuation of application No. 16/867,498, filed on May 5, 2020, granted, now 11,262,846, issued on Mar. 1, 2022.
Application 16/867,498 is a continuation of application No. 14/559,126, filed on Dec. 3, 2014, granted, now 10,684,687, issued on Jun. 16, 2020.
Prior Publication US 2025/0060824 A1, Feb. 20, 2025
Int. Cl. G06F 3/01 (2006.01); G02B 27/01 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01); G06F 3/03 (2006.01); G06F 3/0354 (2013.01); G06F 3/038 (2013.01); G06F 3/0482 (2013.01); G06F 3/04842 (2022.01)
CPC G06F 3/016 (2013.01) [G06F 1/163 (2013.01); G06F 1/203 (2013.01); G06F 3/011 (2013.01); G06F 3/013 (2013.01); G06F 3/0304 (2013.01); G06F 3/03542 (2013.01); G06F 3/03545 (2013.01); G06F 3/0383 (2013.01); G06F 3/0386 (2013.01); G06F 3/0482 (2013.01); G06F 3/04842 (2013.01); G02B 2027/012 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wearable head device, comprising:
a frame;
a first optical module comprising a first reflecting surface, the first optical module having an upper region configured to rest at a first height with respect to the frame;
a second optical module;
a first electronics board disposed adjacent to the frame, further disposed horizontally with respect to the frame, and further disposed between the first optical module and the second optical module at a height less than the first height;
a second electronics board disposed adjacent to the frame, further disposed horizontally with respect to the frame, and further disposed between the first optical module and the second optical module at a height substantially equal to the first height, wherein:
the first electronics board has a first width,
the second electronics board has a second width greater than the first width,
the first electronics board is separated from second electronics board by an air gap, and
one of the first electronics board and the second electronics board comprises a processor; and
a heat sink disposed between the first reflecting surface and the second optical module and configured to rest in front of the processor with respect to the frame, wherein the heat sink is thermally coupled to the processor.