US 12,455,469 B2
Display device capable of effectively dissipating heat of board
Junhee Kong, Seoul (KR); Dongwoo Cho, Seoul (KR); Byungchun Yoo, Seoul (KR); and Sungho Jeon, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 18/573,922
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Nov. 4, 2021, PCT No. PCT/KR2021/015923
§ 371(c)(1), (2) Date Dec. 22, 2023,
PCT Pub. No. WO2022/270689, PCT Pub. Date Dec. 29, 2022.
Claims priority of application No. 10-2021-0081485 (KR), filed on Jun. 23, 2021.
Prior Publication US 2024/0288724 A1, Aug. 29, 2024
Int. Cl. G02F 1/1333 (2006.01)
CPC G02F 1/133314 (2021.01) [G02F 1/133334 (2021.01); G02F 1/133382 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A display device comprising:
a display panel;
a frame which is located in a rearward direction of the display panel, and to which the display panel is coupled;
a first board including an IC chip and coupled to a rear of the frame;
a second board coupled to a rear of the frame;
a back cover covering a rear of the first board and a rear of the second board, and coupled to a rear of the frame; and
a shield plate located between the first board and the back cover, covering the first board, and coupled to the frame,
wherein the shield plate comprises a recessed portion which protrudes toward the first board and which is in contact with the IC chip,
wherein the back cover comprises:
a first heat dissipation plate located between the second board and the back cover and coupled to the back cover;
a second heat dissipation plate located between the second board and the first heat dissipation plate, coupled to the back cover, and having an area larger than an area of the first heat dissipation plate; and
a third heat dissipation plate which is located between the second board and the second heat dissipation plate, which has an area larger than the area of the second heat dissipation plate, and which covers the second heat dissipation plate,
wherein the second heat dissipation plate covers a front of the first heat dissipation plate, and overlaps with the second board,
wherein the third heat dissipation plate overlaps with the second board and is spaced rearward from the second board,
wherein the first heat dissipation plate comprises metal, and
wherein the second heat dissipation plate comprises graphene resin.