US 12,455,423 B2
Co-packaging optical modules with surface and edge coupling
Radhakrishnan L. Nagarajan, San Jose, CA (US); and Mark Patterson, San Jose, CA (US)
Assigned to Marvell Asia Pte Ltd, Singapore (SG)
Filed by Marvell Asia Pte Ltd, Singapore (SG)
Filed on Jul. 27, 2023, as Appl. No. 18/227,180.
Application 18/227,180 is a continuation of application No. 17/190,867, filed on Mar. 3, 2021, granted, now 11,719,898, issued on Aug. 8, 2023.
Prior Publication US 2023/0400651 A1, Dec. 14, 2023
Int. Cl. G02B 6/43 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/43 (2013.01) [G02B 6/4214 (2013.01); G02B 6/4246 (2013.01); G02B 6/4257 (2013.01); G02B 6/426 (2013.01); G02B 6/4261 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A co-packaged electro-optical module, comprising:
a first planar light circuit block;
a second silicon photonics chip electrically coupled to one or more chips;
a splitter embedded in the first planar light circuit block, the splitter being configured to receive laser light from a first optical fiber, to split the laser light into two or more portions, and to provide respective portions of the laser light to two or more planar waveguides;
a planar surface of the silicon photonics chip configured to receive the portions of the laser light from the two or more planar waveguides in a direction perpendicular to the planar surface;
a plurality of modulators embedded in the silicon photonics chip and configured to modulate the portions of the laser light;
a side edge of the silicon photonics chip extending perpendicular to the planar surface and configured to output the modulated portions of the laser light; and
a second planar light circuit block coupled to the side edge and configured to transmit the modulated portions of the laser light output from the side edge.