US 12,455,312 B2
Inspection device for optical semiconductor device configured to correct positions of the plurality of lead terminals
Tomohito Taniuchi, Nagasaki (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 18/259,990
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Jun. 9, 2021, PCT No. PCT/JP2021/021926
§ 371(c)(1), (2) Date Jun. 29, 2023,
PCT Pub. No. WO2022/259424, PCT Pub. Date Dec. 15, 2022.
Prior Publication US 2024/0241169 A1, Jul. 18, 2024
Int. Cl. G01R 31/26 (2020.01); G01R 1/067 (2006.01)
CPC G01R 31/2601 (2013.01) [G01R 1/06705 (2013.01); G01R 1/06794 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An inspection device for inspecting an optical semiconductor device having a plurality of lead terminals, comprising:
a plurality of blocks;
a plurality of electrodes provided on tip ends of the plurality of blocks respectively; and
a plurality of wires,
wherein the plurality of blocks and the plurality of wires are configured to sandwich the plurality of lead terminals such that each of the plurality of lead terminals is sandwiched between one of the blocks and at least one of the wires to correct positions of the plurality of lead terminals, and
the plurality of electrodes are configured to be brought into contact with the plurality of lead terminals to inspect an electrical characteristic of the optical semiconductor device.