US 12,455,301 B2
Hall plate current sensor having stress compensation
Roman Procházka, Struharov (CZ); and Juan Manuel Cesaretti, Buenos Aires (AR)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Dec. 11, 2023, as Appl. No. 18/535,157.
Prior Publication US 2025/0189562 A1, Jun. 12, 2025
Int. Cl. G01R 15/20 (2006.01)
CPC G01R 15/202 (2013.01) 21 Claims
OG exemplary drawing
 
1. A voltage driven Hall plate current sensor integrated circuit (IC) package, comprising:
a die including a Hall plate comprising a Hall lateral epi resistor;
a gm amplifier to receive an output voltage from the Hall plate;
a front end amplifier to receive an output of the gm amplifier;
compensation circuit to compensate for stress on the die that affects a resistance of the Hall plate, the compensation circuit including a compensation lateral epi resistor coupled to a temperature-dependent current for compensating for piezoresistive stress in the Hall plate, wherein the compensation lateral epi resistor is coupled to the gm amplifier;
a bandgap circuit to generate the temperature-dependent current for the compensation lateral epi resistor; and
a vertical epi resistor coupled to a variable current source corresponding to a temperature sensitivity value, wherein the vertical epi resistor is configured to compensate for piezo stress sensitivity of the Hall plate.