US 12,455,298 B2
Test system for testing semiconductor devices
Chih-Ming Chen, Hsinchu County (TW); and Chih-Kang Toh, Hsinchu County (TW)
Assigned to TAIWAN MASK CORPORATION, Hsinchu County (TW)
Filed by TAIWAN MASK CORPORATION, Hsinchu County (TW)
Filed on Dec. 1, 2023, as Appl. No. 18/526,899.
Claims priority of provisional application 63/429,295, filed on Dec. 1, 2022.
Claims priority of application No. 112127734 (TW), filed on Jul. 25, 2023.
Prior Publication US 2024/0183878 A1, Jun. 6, 2024
Int. Cl. G01R 31/28 (2006.01); G01R 1/04 (2006.01)
CPC G01R 1/0458 (2013.01) [G01R 31/2886 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A test system for testing a plurality of semiconductor devices, comprising:
a pressing apparatus, comprising:
a cover, comprising a base plate, an enclosed outer rib wall and an enclosed inner rib wall, the base plate having a bottom surface, the enclosed outer rib wall and the enclosed inner rib wall being formed on the bottom surface of the base plate;
a seat, having an upper surface and comprising an enclosed outer sealing groove and an enclosed inner sealing groove, the enclosed outer sealing groove and the enclosed inner sealing groove being formed on the upper surface of the seat, the enclosed outer sealing groove being configured to receive a first distal end of the enclosed outer rib wall, the enclosed inner sealing groove being configured to receive a second distal end of the enclosed inner rib wall;
a first sealing device, mounted on the enclosed outer rib wall near the first distal end; and
a second sealing device, mounted on the enclosed inner rib wall near the second distal end, when the first distal end of the enclosed outer rib wall is inserted into the enclosed outer sealing groove and the second distal end of the enclosed inner rib wall is inserted into the enclosed inner sealing groove, the base plate, the enclosed inner rib wall and the seat constituting a test chamber, the test chamber having at least one vent, the test chamber communicating with an exterior of said test system through the at least one vent, the first sealing device is pressed between the enclosed outer rib wall and the enclosed outer sealing groove, the base plate, the enclosed outer rib wall, the enclosed inner rib wall and the seat constituting a sealed auxiliary chamber, the auxiliary chamber having at least one extraction hole, the second sealing device being pressed between the enclosed inner rib wall and the enclosed inner sealing groove;
a carrying apparatus, disposed within the test chamber, the carrying apparatus comprising:
at least one circuit board, disposed on the upper surface of the seat; and
a plurality of test sockets, each test socket corresponding to one of the at least one circuit board and being electrically connected to the corresponding circuit board, each semiconductor device being carried by one of the test sockets; and
an abutting apparatus, disposed between the bottom surface of the cover and the test sockets,
wherein the auxiliary chamber is extracted through the at least one extraction hole, such that an air pressure in the auxiliary chamber is lowered to actuate the cover toward the seat and further to apply a force to the abutting apparatus, and such that the abutting apparatus presses against the plurality of semiconductor devices and the plurality of test sockets to allow each test socket to electrically contact with the semiconductor device carried by said one test socket.