US 12,455,160 B2
Package structure and measurement method for the package structure
Kuei-Sung Chang, Kaohsiung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Mar. 19, 2024, as Appl. No. 18/608,956.
Application 18/608,956 is a division of application No. 17/200,868, filed on Mar. 14, 2021, granted, now 11,965,731.
Claims priority of provisional application 63/109,165, filed on Nov. 3, 2020.
Prior Publication US 2024/0263938 A1, Aug. 8, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01B 11/14 (2006.01); G01B 21/16 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/04 (2006.01); H01L 23/043 (2006.01); H01L 23/28 (2006.01); G01B 7/14 (2006.01); G01B 7/31 (2006.01)
CPC G01B 11/14 (2013.01) [G01B 21/16 (2013.01); H01L 21/4817 (2013.01); H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 22/12 (2013.01); H01L 23/04 (2013.01); H01L 23/043 (2013.01); H01L 23/28 (2013.01); G01B 7/14 (2013.01); G01B 7/31 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A measurement method, comprising:
providing a base and a device on the base;
disposing a lid over the device;
forming an opening extending through the lid;
irradiating a top surface of the device through the opening to obtain a first focal plane associated with the top surface of the device;
irradiating the lid at an end of the opening proximal to the top surface of the device to obtain a second focal plane associated with the lid at the end of the opening; and
deriving a vertical distance between the first focal plane and the second focal plane.