US 12,455,124 B2
Radiative cooling device
Masahiro Suemitsu, Osaka (JP); and Masayuki Sugimoto, Osaka (JP)
Assigned to Osaka Gas Co., Ltd., Osaka (JP)
Appl. No. 18/283,947
Filed by Osaka Gas Co., Ltd., Osaka (JP)
PCT Filed Mar. 24, 2022, PCT No. PCT/JP2022/013948
§ 371(c)(1), (2) Date Sep. 25, 2023,
PCT Pub. No. WO2022/202991, PCT Pub. Date Sep. 29, 2022.
Claims priority of application No. 2021-054012 (JP), filed on Mar. 26, 2021.
Prior Publication US 2024/0167776 A1, May 23, 2024
Int. Cl. F28F 13/18 (2006.01); B32B 7/12 (2006.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); F28F 13/00 (2006.01)
CPC F28F 13/18 (2013.01) [B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); B32B 2307/302 (2013.01); B32B 2307/416 (2013.01); B32B 2307/7376 (2023.05); F28F 2013/001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radiative cooling device comprising:
an infrared radiative layer having a radiative surface for radiating infrared light;
a light reflective layer on a side of the infrared radiative layer, which is opposite to the radiative surface; and
a protective layer between the infrared radiative layer and the light reflective layer, and
wherein:
the infrared radiative layer is a resin material layer that has a thickness adjusted so that the resin material layer emits heat radiation energy greater than absorbed solar energy in a wavelength range from 8 μm to 14 μm,
the light reflective layer comprises silver or a silver alloy,
the protective layer comprises a polyolefin resin or a polyethylene terephthalate resin,
the radiative cooling device further comprises an adhesive layer between the resin material layer and the protective layer, the adhesive layer joining the resin material layer to the protective layer, and
the adhesive layer comprises a filler made of an inorganic material.