US 12,455,122 B2
Dynamically enhancing heat transfer through heat pipes
Kevin O'Connell, Mantorville, MN (US); Phillip V. Mann, Rochester, MN (US); William James Anderl, Rochester, MN (US); Alexander Matos, Rochester, MN (US); and Brenda Berg, Rochester, MN (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jun. 26, 2023, as Appl. No. 18/341,305.
Prior Publication US 2024/0426558 A1, Dec. 26, 2024
Int. Cl. F28F 1/32 (2006.01)
CPC F28F 1/32 (2013.01) 19 Claims
OG exemplary drawing
 
1. A heat pipe system to enhance heat transfer from a heat-generating component, the heat pipe system comprising:
one or more heat pipes, each heat pipe of the one or more heat pipes comprising:
an outer shell;
a wick structure coupled to the outer shell, wherein at least a portion of the wick structure defines a chamber therein, the chamber comprising an evaporator portion and a condenser portion; and
one or more vapor blocking devices positioned in the chamber, wherein the one or more vapor blocking devices are configured to dynamically modify an active heat transfer region of the condenser portion, thereby dynamically modulate heat transfer through the condenser portion, and wherein the one or more vapor blocking devices comprises:
one or more sleeves configured to at least partially insulate a portion of the condenser portion from at least a portion of a vapor flowing within the condenser portion, wherein the one or more sleeves comprises:
one or more travel guides to traverse at least a portion of the chamber through one or more respective tracks positioned in the wick structure.