US 12,454,760 B2
Etchant and method of surface treatment of aluminum or aluminum alloy
Takuma Maekawa, Osaka (JP); Katsuhisa Tanabe, Osaka (JP); Sayuri Tanaka, Osaka (JP); and Fuminori Shibayama, Osaka (JP)
Assigned to C.Uyemura & Co., Ltd., Osaka (JP)
Filed by C.Uyemura & Co., Ltd., Osaka (JP)
Filed on Jun. 16, 2023, as Appl. No. 18/336,944.
Claims priority of application No. 2022-097315 (JP), filed on Jun. 16, 2022; and application No. 2023-068416 (JP), filed on Apr. 19, 2023.
Prior Publication US 2023/0407487 A1, Dec. 21, 2023
Int. Cl. C23F 1/20 (2006.01); C23C 18/32 (2006.01); C23G 1/12 (2006.01)
CPC C23F 1/20 (2013.01) [C23C 18/32 (2013.01); C23G 1/125 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method of surface treatment of aluminum or an aluminum alloy, the method comprising a treatment including: bringing a workpiece having aluminum or an aluminum alloy on its surface into contact with an etchant to etch the workpiece, the etchant comprising at least one zinc compound and at least one fluorine compound, the etchant having a pH of 4.5 to 6.5; and pickling the etched workpiece.