US 12,454,636 B2
Adhesive film for polishing pad, laminated polishing pad including the same and method of polishing wafer
Jung Nam Lee, Seoul (KR); Sunghoon Yun, Seoul (KR); and Jangwon Seo, Seoul (KR)
Assigned to Enpulse Co., Ltd., Cheonan-si (KR)
Filed by Enpulse Co., Ltd., Cheonan-si (KR)
Filed on May 24, 2022, as Appl. No. 17/751,942.
Claims priority of application No. 10-2021-0067602 (KR), filed on May 26, 2021.
Prior Publication US 2022/0380644 A1, Dec. 1, 2022
Int. Cl. C09J 167/03 (2006.01); B24B 37/24 (2012.01); C09J 5/06 (2006.01); C09J 7/35 (2018.01); H01L 21/02 (2006.01)
CPC C09J 167/03 (2013.01) [B24B 37/24 (2013.01); C09J 5/06 (2013.01); C09J 7/35 (2018.01); H01L 21/02013 (2013.01); Y10T 428/218 (2015.01); Y10T 428/24273 (2015.01)] 14 Claims
OG exemplary drawing
 
1. An adhesive film for a polishing pad comprising:
a plurality of through holes extended from a top surface to a bottom surface of the adhesive film,
wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film,
wherein the adhesive film has a compressive ratio of 0.98% or more and 3.3% or less, the compressive ratio being calculated by (thickness loss after compression/original thickness of the adhesive film)×100%, when the adhesive film is compressed in a thickness direction under a pressure of 6.89 kPa to 48.26 kPa,
wherein a cross-sectional shape of each of the plurality of through holes, when viewed on a plane perpendicular to the thickness direction of the adhesive film, is substantially the same, and
wherein each of the plurality of through holes has an average cross-sectional area from 6 mm2 to 100 mm2, where the average cross-sectional area is obtained by dividing a total cross-sectional area of the plurality of through holes, which is measured on a plane perpendicular to a thickness direction of the adhesive film, by a total number of the plurality of through holes.
 
11. A laminated polishing pad comprising:
a polishing pad; and
an adhesive film for the polishing pad attached to one surface of the polishing pad,
wherein the adhesive film comprises a plurality of through holes extended from a top surface to a bottom surface of the adhesive film,
wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film,
wherein the adhesive film has a compressive ratio of 0.98% or more and 3.3% or less, the compressive ratio being calculated by (thickness loss after compression/original thickness of the adhesive film)×100%, when the adhesive film is compressed in a thickness direction under a pressure of 6.89 kPa to 48.26 kPa, and
wherein each of the plurality of through holes has an average cross-sectional area from 6 mm2 to 100 mm2, where the average cross-sectional area is obtained by dividing a total cross-sectional area of the plurality of through holes, which is measured on a plane perpendicular to a thickness direction of the adhesive film, by a total number of the plurality of through holes.
 
13. A method of polishing a wafer comprising:
preparing a laminated polishing pad attached to a plate and a polishing head, to which a wafer is fixed; and
rotating any one or both of the plate and the polishing head, while contacting the wafer with the laminated polishing pad with adding slurry,
wherein the laminated polishing pad comprises:
a polishing pad; and
an adhesive film for the polishing pad attached to one surface of the polishing pad,
wherein the polishing pad comprises a plurality of through holes extended from a top surface to a bottom surface of the adhesive film,
wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film,
wherein the adhesive film has a compressive ratio of 0.98% or more and 3.3% or less, the compressive ratio being calculated by (thickness loss after compression/original thickness of the adhesive film)×100%, when the adhesive film is compressed in a thickness direction under a pressure of 6.89 kPa to 48.26 kPa, and
wherein each of the plurality of through holes has an average cross-sectional area from 6 mm2 to 100 mm2, where the average cross-sectional area is obtained by dividing a total cross-sectional area of the plurality of through holes, which is measured on a plane perpendicular to a thickness direction of the adhesive film, by a total number of the plurality of through holes.