US 12,454,634 B2
Adhesive composition, thermosetting adhesive sheet, and printed wiring board
Jun Yamamoto, Shimotsuke (JP); Akira Suzuki, Shimotsuke (JP); Toshiyuki Minegishi, Shimotsuke (JP); and Kazuhiro Date, Shimotsuke (JP)
Assigned to DEXERIALS CORPORATION, Shimotsuke (JP)
Appl. No. 17/630,070
Filed by DEXERIALS CORPORATION, Shimotsuke (JP)
PCT Filed Aug. 6, 2019, PCT No. PCT/JP2019/030802
§ 371(c)(1), (2) Date Jan. 25, 2022,
PCT Pub. No. WO2021/024364, PCT Pub. Date Feb. 11, 2021.
Prior Publication US 2022/0267650 A1, Aug. 25, 2022
Int. Cl. C09J 153/02 (2006.01); B32B 7/12 (2006.01); B32B 25/08 (2006.01); B32B 25/14 (2006.01); H05K 3/28 (2006.01)
CPC C09J 153/025 (2013.01) [B32B 7/12 (2013.01); B32B 25/08 (2013.01); B32B 25/14 (2013.01); B32B 2457/08 (2013.01); H05K 3/281 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An adhesive composition consisting of, with respect to a total of 100 parts by mass of the adhesive composition:
70 to 90 parts by mass of a styrene elastomer;
10 to 20 parts by mass of a modified polyphenyleneether resin having a radical polymerizable group at an end;
in total 10 parts by mass or less of an epoxy resin and a peroxide; and
optionally one or more additional components selected from the group consisting of an organic solvent, a silane coupling agent, a filler for flowability adjustment and a filler for flame retardancy imparting,
wherein a styrene ratio of the styrene elastomer is less than 42%,
wherein the styrene elastomer is an amine-modified styrene elastomer, and
wherein a glass transition temperature of a cured product of the adhesive composition is 80 to 170° C.
 
6. A printed wiring board comprising:
a wiring resin substrate having a base material and a wiring pattern; and
a cover lay laminated on the wiring pattern of the resin substrate via a cured product of an adhesive composition,
wherein the adhesive composition consists of, with respect to a total of 100 parts by mass of the adhesive composition:
70 to 90 parts by mass of a styrene elastomer;
10 to 20 parts by mass of a modified polyphenyleneether resin having a radical polymerizable group at an end;
in total 10 parts by mass or less of an epoxy resin and a peroxide; and
optionally one or more additional components selected from the group consisting of an organic solvent, a silane coupling agent, a filler for flowability adjustment and a filler for flame retardancy imparting,
wherein a styrene ratio of the styrene elastomer is less than 42%,
wherein the styrene elastomer is an amine-modified styrene elastomer, and
wherein a glass transition temperature of the cured product of the adhesive composition is 80 to 170° C.