US 12,454,614 B2
Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cure
Jiguang Zhang, Shanghai (CN); Yan Zheng, Shanghai (CN); Chao He, Shanghai (CN); Xuedong Gao, Shanghai (CN); Qianqing Ge, Shanghai (CN); Dorab Bhagwagar, Auburn, MI (US); Peng Wei, Shanghai (CN); Chen Chen, Shanghai (CN); and Hongyu Chen, Shanghai (CN)
Assigned to Dow Global Technologies LLC, Midland, MI (US); and Dow Silicones Corporation, Midland, MI (US)
Appl. No. 18/004,077
Filed by Dow Global Technologies LLC, Midland, MI (US); and Dow Silicones Corporation, Midland, MI (US)
PCT Filed Sep. 23, 2020, PCT No. PCT/CN2020/116991
§ 371(c)(1), (2) Date Jan. 3, 2023,
PCT Pub. No. WO2022/061559, PCT Pub. Date Mar. 31, 2022.
Prior Publication US 2023/0257582 A1, Aug. 17, 2023
Int. Cl. C08L 83/04 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 5/5419 (2006.01)
CPC C08L 83/04 (2013.01) [C08K 3/22 (2013.01); C08K 5/5419 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01)] 10 Claims
 
1. A thermal interface material composition comprising:
a. a divinyl polydimethylsiloxane having a viscosity of 30 to 200 milliPascal*seconds;
b. a chain extender that is a linear polysiloxane having two terminal silyl hydride functionalities, one at each end of the molecule;
c. a crosslinker that is a polysiloxane having more than two silyl hydride functionalities;
d. 80 volume-percent or more of thermally conductive filler;
e. a treating agent composition comprising an alkyltrialkoxysilane and a mono-trialkoxysiloxy terminated and trimethylsiloxy terminated dimethylpolysiloxanes with a degree of polymerization of 20-120;
f. a platinum hydrosilylation catalyst;
g. up to 0.2 weight-percent hydrosilylation inhibitor; and
wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.