US 12,454,612 B2
Liquid resin composition for compression molding and electronic component apparatus
Hidetoshi Inoue, Tokyo (JP); Takayuki Matsuzaki, Tokyo (JP); Hisato Takahashi, Tokyo (JP); Tsuyoshi Kamimura, Niigata (JP); and Haruyuki Yoshii, Niigata (JP)
Assigned to Resonac Corporation, Tokyo (JP); and NAMICS Corporation, Niigata (JP)
Appl. No. 16/618,635
Filed by Hitachi Chemical Company, Ltd., Tokyo (JP); and NAMICS CORPORATION, Niigata (JP)
PCT Filed May 31, 2018, PCT No. PCT/JP2018/021060
§ 371(c)(1), (2) Date Dec. 2, 2019,
PCT Pub. No. WO2018/221682, PCT Pub. Date Dec. 6, 2018.
Claims priority of application No. 2017-108716 (JP), filed on May 31, 2017.
Prior Publication US 2020/0181392 A1, Jun. 11, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/28 (2006.01); C08G 59/32 (2006.01); C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08K 5/3445 (2006.01); C08K 5/5419 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC C08L 63/00 (2013.01) [C08G 59/245 (2013.01); C08G 59/28 (2013.01); C08G 59/3227 (2013.01); C08K 3/04 (2013.01); C08K 3/36 (2013.01); C08K 5/3445 (2013.01); C08K 5/5419 (2013.01); H01L 23/295 (2013.01); H01L 23/3107 (2013.01); C08K 2201/003 (2013.01)] 10 Claims
 
1. A liquid resin composition for compression molding, comprising an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C) in an amount within the range of from 2 parts by mass to 12 parts by mass per 100 parts by mass in total of epoxy compounds, and an inorganic filler (D),
wherein the epoxy compound (B) having an aromatic ring in a molecule comprises N,N-diglycidylorthotoluidine and N,N-bis(2,3-epoxypropyl)-4-(2,3-epoxypropoxy)aniline,
wherein a curing agent other than the nitrogen-containing heterocyclic compound (C) is in an amount of less than 0.1 equivalent with respect to 1 equivalent of epoxy compounds in the liquid resin composition, and
wherein a cured product of the liquid resin composition for compression molding has a linear expansion coefficient of 15 ppm/° C. or less at a temperature less than the cure product's glass transformation temperature.