| CPC C08J 5/243 (2021.05) [B32B 5/26 (2013.01); B32B 27/12 (2013.01); B32B 27/38 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2305/72 (2013.01); C08J 2363/00 (2013.01)] | 10 Claims |
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1. A prepreg comprising composition elements [A], [B], and [C] described below, wherein:
[C] is present on a surface of the prepreg, [B] contains a first curing agent [b1] and a second curing agent [b2], and a reinforcing fiber [A] that crosses over a boundary surface between a resin region containing [B] and a resin region containing [C] and that is in contact with both resin regions is present:
[A] a reinforcing fiber,
[B] a thermosetting resin, and
[C] a thermoplastic resin,
wherein the first curing agent [b1] is diaminodiphenyl sulfone, and the second curing agent [b2] is dihydrazide isophthalate,
wherein a blending ratio of the first curing agent [b1] to the second curing agent [b2] satisfies 0.16≤mole number of [b2]/mole number of [b1]≤0.24,
wherein composition element [A] has a surface free energy of 20 to 50 mJ/m2 as measured by a Wilhelmy method and is formed from a sizing agent selected from polyethylene glycol diglycidyl ether, bisphenol A diglycidyl ether and sorbitol polyglycidyl ether
wherein composition element [B] is tetraglycidyl diaminodiphenylmethane or bisphenol A epoxy resin,
wherein composition element [C] is a polyamide, polyether ketone ketone, polyether ether ketone, polyetherimide or polyphenylene sulfide.
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