US 12,454,082 B2
Resin molding device and method for producing resin molded article
Fuyuhiko Ogawa, Kyoto (JP); and Yoshito Okunishi, Kyoto (JP)
Assigned to TOWA CORPORATION, Kyoto (JP)
Appl. No. 18/270,479
Filed by TOWA CORPORATION, Kyoto (JP)
PCT Filed Nov. 15, 2021, PCT No. PCT/JP2021/041834
§ 371(c)(1), (2) Date Jun. 29, 2023,
PCT Pub. No. WO2022/201625, PCT Pub. Date Sep. 29, 2022.
Claims priority of application No. 2021-050848 (JP), filed on Mar. 24, 2021.
Prior Publication US 2024/0051199 A1, Feb. 15, 2024
Int. Cl. B29C 45/02 (2006.01); B29C 45/14 (2006.01); B29C 45/34 (2006.01); B29C 45/56 (2006.01); B29C 45/64 (2006.01); B29C 45/76 (2006.01); B29C 45/77 (2006.01); B29C 45/80 (2006.01)
CPC B29C 45/02 (2013.01) [B29C 45/14639 (2013.01); B29C 45/14655 (2013.01); B29C 45/34 (2013.01); B29C 45/56 (2013.01); B29C 45/64 (2013.01); B29C 45/76 (2013.01); B29C 45/7613 (2013.01); B29C 45/7653 (2013.01); B29C 45/77 (2013.01); B29C 45/80 (2013.01); B29C 2045/14852 (2013.01); B29C 2945/76498 (2013.01); B29C 2945/76545 (2013.01); B29C 2945/76568 (2013.01); B29C 2945/76598 (2013.01); B29C 2945/76678 (2013.01); B29C 2945/76702 (2013.01); B29C 2945/76742 (2013.01); B29C 2945/76869 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A resin molding device, comprising:
a lower mold on which a substrate is placed;
an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of ascending and descending vertically with respect to the side block;
a clamp mechanism which clamps the lower mold and the upper mold;
a transfer mechanism which supplies a resin material into the cavity by a plunger;
a chip volume measurement part which measures a volume of a chip arranged on the substrate;
a resin volume measurement part which measures a volume of the resin material; and
a controller which is configured to calculate a relationship between a position of the plunger and a resin filling rate of the cavity based on the volume of the chip arranged on the substrate measured by the chip volume measurement part and the volume of the resin material measured by the resin volume measurement part, to perform filling rate correspondence control for controlling an operation related to resin molding triggered as a result of the plunger reaching a position corresponding to a predetermined resin filling rate.