US 12,454,077 B2
Dividing apparatus
Shinya Aruga, Tokyo (JP); and Hiroaki Kobayashi, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Feb. 28, 2023, as Appl. No. 18/175,710.
Claims priority of application No. 2022-033407 (JP), filed on Mar. 4, 2022.
Prior Publication US 2023/0278260 A1, Sep. 7, 2023
Int. Cl. B28D 5/00 (2006.01)
CPC B28D 5/0064 (2013.01) [B28D 5/0023 (2013.01); B28D 5/0052 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A dividing apparatus that divides, at any one of a plurality of projected dicing lines set in a grid pattern, a wafer in which division initiating points are formed along the plurality of projected dicing line and one of a first surface and a second surface is affixed to a central area of a support member that has an outer circumferential area to which an annular frame is affixed, the dividing apparatus comprising:
a holding table that holds the frame on a holding surface formed with an opening at a center thereof;
a first camera that forms a first image to be used for identifying positions of the plurality of projected dicing lines, by imaging the wafer from a side of the first surface in a state in which the frame is held on the holding surface;
a dividing unit that includes a pressing section configured to divide the wafer at a first projected dicing line that is one of the plurality of projected dicing lines by pressing a portion near the first projected dicing line from a side of the other of the first surface and the second surface;
a second camera that forms a second image to be used for determining whether or not the wafer is divided at the first projected dicing line, by imaging the wafer from a side of the second surface in a state in which the frame is held on the holding surface; and
a controller that controls the first camera, the dividing unit, and the second camera,
wherein the controller includes:
a determination section configured to determine whether or not the wafer is divided at the first projected dicing line, in reference to the second image formed by the imaging performed by the second camera after the dividing unit is operated to divide the wafer at the first projected dicing line, and
a driving section that operates the dividing unit again to divide the wafer at the first projected dicing line, in a case where the determination section determines that the wafer is not divided at the first projected dicing line.