US 12,454,032 B2
Substrate processing apparatus
Yohei Sato, Tokyo (JP); Hiroshi Koizumi, Tokyo (JP); Osamu Shindo, Tokyo (JP); Mitsuyoshi Makida, Tokyo (JP); and Masashi Matsumoto, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on May 25, 2023, as Appl. No. 18/323,820.
Claims priority of application No. 2022-086037 (JP), filed on May 26, 2022.
Prior Publication US 2023/0381903 A1, Nov. 30, 2023
Int. Cl. B23Q 1/03 (2006.01)
CPC B23Q 1/032 (2013.01) 5 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising
a lower jig plate for arranging an object to be pressurized,
columnar members supporting the lower jig plate, and
a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members, wherein
the heat dissipating column includes
a column main body, and
a cover portion covering the column main body and comprising a material with a higher thermal conductivity than the column main body.