US 12,454,029 B2
Laser processing apparatus, methods of laser-processing workpieces and related arrangements
Jan Kleinert, Beaverton, OR (US); Zhibin Lin, Beaverton, OR (US); and Hisashi Matsumoto, Beaverton, OR (US)
Assigned to Electro Scientific Industries, Inc., Beaverton, OR (US)
Filed by ELECTRO SCIENTIFIC INDUSTRIES, INC., Beaverton, OR (US)
Filed on Jun. 22, 2021, as Appl. No. 17/354,680.
Application 17/354,680 is a division of application No. 15/750,140, granted, now 11,077,526, previously published as PCT/US2016/050804, filed on Sep. 8, 2016.
Claims priority of provisional application 62/366,984, filed on Jul. 26, 2016.
Claims priority of provisional application 62/294,991, filed on Feb. 12, 2016.
Claims priority of provisional application 62/271,446, filed on Dec. 28, 2015.
Claims priority of provisional application 62/241,624, filed on Oct. 14, 2015.
Claims priority of provisional application 62/216,102, filed on Sep. 9, 2015.
Prior Publication US 2021/0316400 A1, Oct. 14, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/082 (2014.01); B23K 26/382 (2014.01); B23K 26/70 (2014.01); B23K 103/00 (2006.01)
CPC B23K 26/382 (2015.10) [B23K 26/0622 (2015.10); B23K 26/082 (2015.10); B23K 26/703 (2015.10); B23K 2103/54 (2018.08)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
scanning a beam of laser energy along a process trajectory to form a via in a workpiece,
wherein the process trajectory defines a sequence of spot locations to be addressed upon irradiating the workpiece with a plurality of laser pulses during formation of the via,
wherein the workpiece comprises an electrical conductor structure in thermal contact with a dielectric structure,
wherein the electrical conductor structure is positioned between a source of the beam of laser energy and the dielectric structure,
wherein characteristics of the beam of laser energy and the scanning are such that laser energy delivered to the spot locations:
a) heat a first region of the electrical conductor structure such that heat accumulating within the first region of the electrical conductor structure is transferred to the dielectric structure to vaporize a first region of the dielectric structure to create a pocket beneath the first region of the electrical conductor structure,
wherein the pocket comprises a high-pressure region between the first region of the dielectric structure and a first region of the electrical conductor structure, and
b) further heats the first region of the electrical conductor structure above the pocket such that the high pressure region ejects at least a portion of the heated first region of the electrical conductor structure from the workpiece.