US D1,048,030 S
Housing module for an electronic device
Jody Akana, Los Altos Hills, CA (US); Molly Anderson, San Francisco, CA (US); Bartley K. Andre, Palo Alto, CA (US); Shota Aoyagi, San Francisco, CA (US); Anthony Michael Ashcroft, San Francisco, CA (US); Marine C. Bataille, San Francisco, CA (US); Jeremy Bataillou, San Francisco, CA (US); Trent J. Canales, Sacramento, CA (US); Abidur Rahman Chowdhury, San Francisco, CA (US); Clara Geneviève Marine Courtaigne, Palo Alto, CA (US); Markus Diebel, San Francisco, CA (US); Richard Hung Minh Dinh, Saratoga, CA (US); Michael Walter Firka, Cupertino, CA (US); Jonathan Gomez Garcia, San Francisco, CA (US); M. Evans Hankey, San Francisco, CA (US); Julian Hoenig, San Francisco, CA (US); Richard P. Howarth, San Francisco, CA (US); Jonathan P. Ive, San Francisco, CA (US); Julian Jaede, San Francisco, CA (US); Duncan Robert Kerr, San Francisco, CA (US); Benjamin J. Pope, Mountain View, CA (US); Peter Russell-Clarke, San Francisco, CA (US); Benjamin Andrew Shaffer, San Jose, CA (US); Sung-Ho Tan, Vienna (AT); Clement Tissandier, San Francisco, CA (US); Eugene Antony Whang, San Francisco, CA (US); and Rico Zörkendörfer, San Francisco, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jul. 11, 2022, as Appl. No. 29/845,829.
Application 29/845,829 is a continuation of application No. 29/714,471, filed on Nov. 22, 2019, granted, now D957402.
This patent is subject to a terminal disclaimer.
Term of patent 15 Years
LOC (14) Cl. 14 - 02
U.S. Cl. D14—439
OG exemplary drawing
 
The ornamental design for a housing module for an electronic device as shown and described.