Thomas R. Marrapode, Naperville, IL (US); Jesus Enrique Fung, Westmont, IL (US); Andrew Kolak, Villa Park, IL (US); Wenzong Chen, Naperville, IL (US); Sung-Ping Huang, Hsinchu (TW); Chih Chung Wu, Hsinchu (TW); Sheng-Pin Su, Hsinchu County (TW); and Chien-Lang Tai, Hsinchu (TW)
Assigned to Molex, LLC, Lisle, IL (US)
Filed by Molex, LLC, Lisle, IL (US)
Filed on May 23, 2022, as Appl. No. 29/839,642.
Term of patent 15 Years
LOC (14) Cl. 13 - 03
U.S. Cl. D13—133
The ornamental design for a connector housing as shown and described.
