CPC H05K 7/20927 (2013.01) [H01L 23/3677 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01)] | 14 Claims |
1. A semiconductor module including a cooling device, the cooling device comprising:
a ceiling plate;
a side wall connected to the ceiling plate;
a bottom plate opposed to the ceiling plate and connected to the side wall;
a plurality of pin fins having a polygonal shape and arranged separately from each other in a matrix form in a planar view in which one end of the respective pin fins is connected to a fin region having a rectangular shape and separated from the side wall on a surface of the ceiling plate opposed to the bottom plate;
an inlet for a coolant having a center of a flow path at a position adjacent to a part of one of long sides of the fin region in the planar view; and
an outlet for the coolant having a center of a flow path at a position adjacent to a part of another one of the long sides of the fin region in the planar view,
wherein matrix directions of the respective pin fins make an angle with a straight line connecting the position of the inlet and the position of the outlet,
a length of a segment of the straight line passing across the fin region is longer than a length of short sides of the fin region, and
a direction in which an angle with respect to one of the short sides of the fin region increases is defined as a positive direction, and a direction in which an angle with respect to the one of the short sides of the fin region decreases is defined as a negative direction, and one side of the respective pin fins makes an angle with the straight line in a range of −40 degrees or greater and −30 degrees or less or an angle of 30 degrees or greater and 40 degrees or less.
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