| CPC H05K 13/0411 (2018.08) [B65G 47/91 (2013.01); H05K 13/0413 (2013.01); H05K 13/0409 (2018.08)] | 4 Claims |
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1. A component adsorption nozzle, comprising:
a nozzle body having a fitting hole which is opened upward;
an engagement portion provided inside the fitting hole;
a pair of engagement projections provided outside the nozzle body, projecting sideward;
a nozzle lower end portion attached to the nozzle body movably up and down, and which is configured to come into contact with a component in order to adsorb the component; and
a buffer member biasing the nozzle lower end portion downward with respect to the nozzle body,
wherein an engaged portion provided on a lower end of one of a plurality of rotary shafts which are arranged circumferentially and included in a rotary head is configured to fit into the fitting hole from above,
the engagement portion is configured to engage with the engaged portion by coming into contact from above with the engaged portion which is fitted into the fitting hole,
engagement between the engagement portion and the engaged portion is maintained by biasing the nozzle body downward by a biasing member of the rotary head,
the pair of engagement projections are configured for engagement from above with a pair of engaged projections provided on a pair of elastic members, respectively, which are provided on a lower end of one of a plurality of in-line shafts which are arranged linearly and included in an in-line head, by entering between the pair of engaged projections from below while separating the pair of engaged projections from each other against an elastic force of the elastic members, and
engagement between the engagement projections and the engaged projections is maintained by the elastic force of the pair of elastic members.
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4. A component mounting system, comprising:
a rotary type component mounter including a rotary head, which has a plurality of rotary shafts arranged circumferentially, and configured to mount a component onto a board by adsorbing the component by a component adsorption nozzle attached to a lower end of one of the rotary shafts; and
an in-line type component mounter including an in-line head, which has a plurality of in-line shafts arranged linearly, and configured to mount a component onto a board by adsorbing the component by a component adsorption nozzle attached to a lower end of one of the in-line shafts,
wherein the component adsorption nozzle comprises:
a nozzle body having a fitting hole which is opened upward,
an engagement portion provided inside the fitting hole,
a pair of engagement projections provided outside the nozzle body, projecting sideward,
a nozzle lower end portion attached to the nozzle body movably up and down, which is configured to come into contact with a component in order to adsorb the component, and
a buffer member biasing the nozzle lower end portion downward with respect to the nozzle body, and
wherein an engaged portion provided on a lower end of one of the plurality of rotary shafts is configured to fit into the fitting hole from above,
the engagement portion is configured to engage with the engaged portion by coming into contact from above with the engaged portion which is fitted into the fitting hole,
engagement between the engagement portion and the engaged portion is maintained by biasing the nozzle body downward by a biasing member of the rotary head,
the pair of engagement projections are configured for engagement from above with a pair of engaged projections provided on a pair of elastic members, respectively, which are provided on a lower end of one of a plurality of in-line shafts which are arranged linearly and included in an in-line head, by entering between the pair of engaged projections from below while separating the pair of engaged projections from each other against an elastic force of the elastic members, and
engagement between the engagement projections and the engaged projections is maintained by the elastic force of the pair of elastic members.
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