US 12,127,338 B2
Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus
Mikael Tuominen, Pernio (FI); Nick Xin, Shanghai (CN); and Seok Kim Tay, Singapore (SG)
Assigned to AT&S(China) Co. Ltd., Shanghai (CN)
Filed by AT&S (China) Co. Ltd., Shanghai (CN)
Filed on Feb. 25, 2022, as Appl. No. 17/652,580.
Application 17/652,580 is a continuation in part of application No. 16/947,477, filed on Aug. 3, 2020, granted, now 11,291,119.
Claims priority of application No. 201910721771.2 (CN), filed on Aug. 6, 2019.
Prior Publication US 2022/0256686 A1, Aug. 11, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/028 (2013.01) [H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 1/182 (2013.01); H05K 3/30 (2013.01); H05K 3/4626 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/096 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semi-flex component carrier, comprising:
a stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the stack defines at least one rigid portion and at least one semi-flexible portion; and
a component embedded in the at least one rigid portion;
wherein a transition region between the at least one semi-flexible portion and the at least one rigid portion has a slanted sidewall,
wherein the transition region further comprises a stress propagation inhibiting barrier comprising a plurality of stacked vias filled at least partially with electrically conductive material and configured for inhibiting stress propagation from the at least one semi-flexible portion to the component.