US 12,127,332 B2
Electronic equipment
Yuta Tamaki, Tokyo (JP); and Katsushi Ito, Tokyo (JP)
Assigned to Sony Interactive Entertainment Inc., Tokyo (JP)
Appl. No. 17/609,500
Filed by Sony Interactive Entertainment Inc., Tokyo (JP)
PCT Filed May 21, 2020, PCT No. PCT/JP2020/020161
§ 371(c)(1), (2) Date Nov. 8, 2021,
PCT Pub. No. WO2020/235644, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 2019-096800 (JP), filed on May 23, 2019.
Prior Publication US 2022/0232693 A1, Jul. 21, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0219 (2013.01) [H05K 1/0209 (2013.01); H05K 5/03 (2013.01)] 7 Claims
OG exemplary drawing
 
1. Electronic equipment comprising:
a printed circuit board;
a shield member covering at least a portion of the printed circuit board, the shield member including an opening such that a region of the printed circuit board is exposed through the opening of the shield member; and
a heat sink having a protruding portion that extends to the printed circuit board through the opening.