US 12,126,370 B2
High-frequency module and communication apparatus
Isao Takenaka, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Jun. 17, 2022, as Appl. No. 17/807,512.
Application 17/807,512 is a continuation of application No. PCT/JP2020/045266, filed on Dec. 4, 2020.
Claims priority of application No. 2020-019941 (JP), filed on Feb. 7, 2020.
Prior Publication US 2022/0321154 A1, Oct. 6, 2022
Int. Cl. H04B 1/04 (2006.01); H01L 23/66 (2006.01); H03F 3/24 (2006.01); H04B 1/38 (2015.01); H03F 1/56 (2006.01)
CPC H04B 1/04 (2013.01) [H01L 23/66 (2013.01); H03F 3/24 (2013.01); H01L 2223/6644 (2013.01); H03F 1/565 (2013.01); H03F 2200/165 (2013.01); H03F 2200/451 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A high-frequency module comprising:
a plurality of filters configured to be selectively connected to an antenna terminal;
a plurality of amplifiers;
a first switch having a first common terminal and a plurality of first selection terminals, the plurality of filters being respectively connected to the plurality of first selection terminals;
a second switch having a second common terminal and a plurality of second selection terminals, the plurality of amplifiers being respectively connected to the plurality of second selection terminals;
a plurality of signal paths, each signal path being between one of the plurality of filters and a corresponding one of the plurality of amplifiers, and each of the plurality of signal paths sharing a common path portion between the first common terminal of the first switch and the second common terminal of the second switch,
a first inductor connected to the common path portion;
a plurality of second inductors, each of the plurality of second inductors being in a different signal path and in a portion of the respective signal path other than the common path portion; and
a mounting substrate having a first main surface and a second main surface that are opposite to each other,
wherein the first inductor is a surface mount inductor located on the first main surface of the mounting substrate, and
wherein the plurality of second inductors are each:
an inductor disposed within an integrated circuit (IC) chip comprising the plurality of amplifiers, or
an inductor comprising a conductive pattern in or on the mounting substrate.