US 12,126,158 B2
Busbar assembly and method for manufacturing the same
Shota Tatsumi, Kyoto-shi (JP)
Assigned to Suncall Corporation, Kyoto (JP)
Appl. No. 17/597,039
Filed by SUNCALL CORPORATION, Kyoto (JP)
PCT Filed Jun. 12, 2020, PCT No. PCT/JP2020/023142
§ 371(c)(1), (2) Date Dec. 23, 2021,
PCT Pub. No. WO2020/262030, PCT Pub. Date Dec. 30, 2020.
Claims priority of application No. 2019-117512 (JP), filed on Jun. 25, 2019.
Prior Publication US 2022/0239086 A1, Jul. 28, 2022
Int. Cl. H02G 5/00 (2006.01)
CPC H02G 5/005 (2013.01) 15 Claims
OG exemplary drawing
 
1. A busbar assembly comprising:
a plurality of busbars each formed by a conductive flat plate member and disposed in a common plane with a gap provided between adjacent busbars;
an insulative resin layer including a gap filling part filled into the gap and a first surface-side laminate part provided on a first surface on one side in a plate thickness direction of a busbar connection body in which the plurality of busbars are connected to one another by the gap filling part;
the first surface-side laminate part having a plurality of first surface-side center openings that expose predetermined parts of the first surfaces of the plurality of busbars, respectively, to form a plurality of exposure regions;
the insulative resin layer being formed by an insulative resin material that is transparent in a half-cured state and nontransparent in a completely cured state; and
a frame that includes a cylindrical frame body with a center hole and a second insulative resin layer covering an outer peripheral surface of the frame body,
wherein the frame is fixed to a peripheral area of the first surface of the busbar connection body so as to surround the plurality of first surface-side center openings in plan view.